Available in the Texas Instruments NanoStar? Inputs Accept Voltages to 5. Max tpd of 3. Low Power Consumption, ? A Max ICC? The output is disabled when the output-enable OE input is high.
|Published (Last):||7 July 2019|
|PDF File Size:||11.61 Mb|
|ePub File Size:||2.12 Mb|
|Price:||Free* [*Free Regsitration Required]|
APRIL ? Contact factory for details. Q qualification data available on request. The output is disabled when the output-enable OE input is high. This device is fully specified for partial-power-down applications using Ioff.
The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.
Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Supply voltage range, VCC.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD CL includes probe and jig capacitance. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. The outputs are measured one at a time, with one transition per measurement. All parameters and waveforms are not applicable to all devices. Figure 1. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Samples may or may not be available. None: Not yet available Lead Pb-Free. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.
Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used.
Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.